Κόλληση - lead-free 0.5 mm
Details
This very thin soldering tin is very suitable for repairs to phones, motherboards or other electronics. This is because it is thin enough for small components, and lead-free for good mixing with the tin already present on the circuit board.
Be aware, this soldering tin is extremely thin.
Specifications
| Tin (Sn) | 97% |
| Silver (Ag) | 0.3% |
| Copper (Cu) | 0.7% |
| Flux | 2% |
| Melting temperature | 217 - 225 ̊C |
| Weight | 90 g |
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